inSilica's ASIC/SoC group is focused on delivering customer specific SoC products in record time to OEMs worldwide. inSilica's flexible supply chain infrastructure, inFlex^TM and supplier partnerships ensure that customers receive cost effective, reliable, and predictable supply of packaged, tested and qualified SoC devices.

inSilica has assembled a world class design team that has delivered industry leading microprocessors, networking, graphics, wireless and audio/video products for both infrastructure and consumer applications. Our design capabilities include high speed deep sub micron design, analog/mixed signal and RF. inSilica operations team has delivered high volume products in both leading edge deep submicron as well as cost effective mature technologies.

inSilica's unique correct by construction SoC design methodology, inGenious^TM, cross checks timing closure, test methodology and layout at each step in the process to ensure all aspects of the design flow are flawlessly executed. inSilica, with its flexible engagement model couples strategic third party IP with its own extensive in-house IP and broad domain expertise to give customers unparalleled advantages in the marketplace by providing ASIC & SoC solutions which are:

• Higher Performance
  
• Lower Power Consumption
  
• Reduced time-to-market
  
• Cost optimized

inSilica partners with best in class companies to provide customers with leading edge fabricators, specialty as well as volume package and assembly suppliers. These strategic initiatives allow inSilica to design and deliver the most exciting and challenging SoC devices to today's market