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inSilica's Engineers have a proven track record of delivering some of the world's most complex SoC solutions. Our team averages over 10 years of semiconductor design experience, many of whom joined inSilica from large US based semiconductor companies. Our team is uniquely positioned to execute the most complex SoC designs in a variety of process technologies and end market applications.
inSilica offers a variety of flexible customer engagement models.
| inDesignTM |
Interface with inSilica at the Design Specification Level |
| inRTLTM |
Interface with inSilica at the RTL level |
| inNetlistTM |
Interface with inSilica at the gate level |
Due to the complex nature of the designs targeted, typical engagements begin early on in the design cycle to ensure that customer performance goals are met according to the jointly developed design schedule.
inSilica Engineering teams typically work in a highly interactive fashion with our customers throughout the design cycle, ensuring convergence between logical and physical design aspects resulting in projects being delivered on time, meeting performance goals, and within the stated budget.
inSilica's design engineering teams possess strong domain knowledge in the areas of wire-line networking, computer server, and wireless network market segments. This domain knowledge allows our engineering teams to act as a valuable extension of our client's own engineering resources taking on tasks which other suppliers may not be able to execute.
inSilica's proven proprietary design methodology, inGeniousTM is derived from industry standard tools and has been proven in multiple generations of microprocessor and SoC projects consistently delivering first time right silicon. Our customers who use this methodology through their engagement with inSilica enjoy the benefits of a true COT flow which increases the performance and lowers the power consumption of their designs while also delivering a smaller more tightly integrated die with superior utilization.
A diverse set of strategic partners allows inSilica to leverage our partner's unique areas of expertise to solve complex engineering problems such as custom I/O requirements, custom packaging, unique reliability characterization, and proprietary IP development. No longer will an SoC customer be constrained by a rigid set of design rules. inSilica will also work in concert with our partners to deliver custom solutions as needed. |
